tooling USD26 impedance control high frequency online ups pcb
The detailed specification of pcb circuit board :
Material | FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc. |
Layer counts | 2-28 layers |
Finished Copper Thickness | 0.5-5 OZ |
Finished Board Thickness | 0.2-6.0mm |
Min. Line/Track Width | 3mil |
Min. Line/Track Space | 3mil |
Min. Contour Tolerance | +/-0.1mm |
Min. Finished Diameter of PTH Hole | 0.2mm |
Max. Board Thickness/Hole Ratio | 12:1 |
Min. Solder Mask Bridge | 4mil (Min. SMT Pad Space 8mil) |
Min. Legend (Silk screen) Track Width | 5mil |
Min. Legend (Silk screen) Height | 30mil |
Min. drilling slot size | 0.6mm |
Solder mask color | green, black, blue, white, yellow, purple, and matt, etc. |
Solder mask hardness | 6H |
Legend/Silk screen Color | white, yellow, black, etc. |
Surface Treatment | HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc. |
Other Technology | Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc. |
Reliability Test | flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc. |
Wrap and twist | ≤0 |
Flammability | 94V-0 |
Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology Various sizes like 1206, 0805, 0603 components SMT technology ICT(In Circuit Test), FCT(Functional Circuit Test) technology PCB Assembly With UL, CE, FCC, Rohs Approval Nitrogen gas reflow soldering technology for SMT High Standard SMT&Solder Assembly Line High density interconnected board placement technology capacity |
Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate |
OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA PCBA and enclosure design Components sourcing and purchasing Quick prototyping Plastic injection molding Metal sheet stamping Final assembly Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) Custom clearance for material importing and product exporting |
Other PCB Assembly Equipment | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 Reflow Oven: FolunGwin FL-RX860 Wave Soldering Machine: FolunGwin ADS300 Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
Related PCB Products
1.Guide for components selection: Assistance for type number and specification selection of the main components based on customers’ requests
2. Discussion for schema design: discuss how to make the design based on the components selected. Conquer the difficulties and issues and deal with the questions during the design process together.
3. Rules for PCB layout and routings: help customers making best layout and rules for routings to reduce cost on both time and money(pcb)
Sulution Provide :
1.Real time control product based on open or close loop, including motor status monitor and control, high-accuracy movement position, remote wire/ wireless transmit and control.
2.Intelligent controller based on automatically control, inculding distributed analog value sampling, solar and wind power generation, charging and inverting products.
3. Rapid Prototyping Device, including 3D printing device control system, Super-power laser control system.
PCB Layout Design Service:
We provide custom-design service for customers who have a product need to be done but know little about the electronic product design. You can just give us the function requests, final cost, environment used and other corresponding information of your product, we can make it out based on your request and provide prototype and design files.(pcb)