Coefficient of Expansion(20°C~350°C) | 5.5*10-7/°C |
Softening Point( viscosity) | 1750°C |
Annealing Point | 1215°C |
Deformation Temperature(long time heat retaining) | 1120°C |
Thermal Conductivity(W/m°C,20°C) | 1.4 |
Specific Heat(J/kg,20°C) | 670 |
Material | Silicon Dioxide (Natural Quartz ) |
Surface | No Air Bubble ,no process |
PPM grade | Controlled 10/20/100 PPM |
Thickness | 0.5 MM-100 MM |
Application | 1.Windows 2. Lenses 3. Mirror substrates 4. Crucibles, trays and boats 5. UV transmitting optics (synthetic fused silica) 6. IR transmitting optics 7. Metrology components |