DH-G600 BGA Rework Station Main Features:
1.Widely used in the Chip Level Replacement in laptop, computer, Moblie Phone, etc.
2.Automatic Romoving,Mounting and Soldering.
3.HD Optical Alignment system for precisely mounting BGA and Components.
4.Laser Positioning can quickly align BGA Chip and motherboard.
5.BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
6.Superior Safety Functions, with Emergency protection.
7.User-friendly operation system.Easy to operate.
Notice: The model is designed as 220V unit, you may need a transformer to use the machine in your country. we also do accept special orders for 110V / 230V/ 240V units
Product name | soldering and desoldering machine |
Total power | 5300W |
top heating | 1200w |
bottom heating | bottom hot air heating 1200W, IR preheating 2700W |
Power | 220V 50HZ/60HZ |
Positioning | V-groove, PCB boards can be adjusted in X, Y axis and equipped with universal fixture |
Temperature control | K-type, Closed loop |
PCB size | Max 400x380mm, Min 22x22mm |
Chip size | 2x2-50x50mm |
Minimum chip spacing | 0.15mm |
External temperature sensor | 1(optional) |
N.W. | approx 60kg |
Suitable motherboards | mobile phone, laptop, desktop, game console, XBOX360, PS3 |
Main Features | 1.CCD camera systerm 2.optical alignment 3.PLC control 4.laser postioning 5.portable drawer style HD touch screen |
Accessories | -1 piece user guide -1 piece LCD -5 pcs hot air nozzle: top nozzle 3pc(31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm)PS: Hot air nozzle size can be customized according to your chip size -1 set of vacuum sucker(including 4 pcs) -2 pcs vacuum pad -6 pcs universal fixture -4 pcs supporting screw -6 pcs Plum knob |
It can zoom from 10x up to 200x. Even though the chip spacing is 0.15mm, it also can perform well.
V-groove, PCB boards can be adjusted in X, Y axis and equipped with universal fixture
The scaleplate indicates the positioning height for further alignment.
Welcome to consult if you have any other question.
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