External Dimension | L2100×W1000×H1500MM | Cooling mode | Computer fan cooling | |
Frame Dimension | L1450*W1000MM*H1500 | Suit for Soldering | Lead free/general soldering | |
PCB board adjustable width | Max.50~250mm | Solder stove power | 6kw | |
PCB board transport height | 650±50mm | Tin Furnace Dissolve tin amount | Approx.110KG | |
PCB board transport speed | 0~1800mm/min | Tin Furnace temperature | Room temperature~300℃、Control precision±1-2℃ | |
PCB board welding angle | 3~7° | Control temperature type | P.I.D+SSR | |
PCB board transport direction | L→R/R→L(can choose it) | Machine control mode | Mitsubishi PLC+Display touch screen | |
PCB board component height | Max.100mm | Flux storage tank | Max5.2L | |
Peak wave height wave | 0—12mm adjustable,and keep the peak wave can balanced | Solder fluxes | 10~100ml/min | |
Wave quantity | 2 | Spraying mode | Motor-driven spray | |
Preheating Zone Height | 700MM | Power Supply | 3 phase 5 wire system 380V | |
Preheating Zone quantity | 2 | Total Power | max.10kw | |
Preheating Power | 6kw | Normal operating power | Approx.2kw | |
Preheating Temperature | Room temperature~250℃ settable | Air Source | 4~7KG/CM2 | |
Heating Mode | Hot wind | Weight | Approx.400kg |