1. Bonding (infrared thermal reactor, IGBT, Thermal printer head, Integrate module, semiconductor module,etc).
2. Hybrid designs and construction.3. NTC Temperature sensor.
NTC Thermistor Die Chip Main Techno-Parameters | ||||||||||
Specific Drawings & dimensions & specifications & parameters can be custom-made; feel free to contact us! | ||||||||||
Rated Zero Power Resistance(R25℃) | 1-100k ohm / Customized | |||||||||
Allowable tolerance of R25℃ | ±1%,2%,3%,5% | |||||||||
Range of Beta Value (B25/50℃) | 3950k, (Customized: 3100 ~ 4500 k) | |||||||||
Thermal time constant | ≤ 15 s (in still air ) | |||||||||
Thermal dissipation constant | ≤15 sec | |||||||||
Operating Temperature | -40℃ ~ +250℃ | |||||||||
Dimensions | 0.5*0.5mm,or Custom-made as requirements |