Technical parameters
Model |
JF800902 |
JF800905 |
JF800903 |
JF800904 |
JF800901 |
Alloy Composition
|
Sn96.5Ag3.0Cu0.5 |
Sn99Ag0.3Cu0.7 |
Sn42Bi58 |
Sn64Bi35Ag1 |
Sn63Pb37 |
Melting Point |
217°C |
219°C |
138°C |
139°C |
183°C |
Powder Specification |
25-45mm |
25-45mm |
25-45mm |
25-45mm |
20-38mm |
Flux Content |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
Viscosity |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
Solder ball Test |
Qualified |
Qualified |
Qualified |
Qualified |
Qualified |
Expansion Rate |
Qualified |
Qualified |
Qualified |
Qualified |
Qualified |
Package &delivery:
Product usage:
The Lead Solder Paste is composed of environment-friendly flux and low oxidaton spherical powder,which were characterized by high print definition,excellent solderability and bright and smooth solder joint.
Tin solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.