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low temperature lead solder paste for SMT welding

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Meorient Import & Export Co.LTD

China - Hangzhou

Trading Company

Trade Capacity

Export Percentage

Nearest Port

Hangzhou,Shanghai

Accepted Delivery Terms

Employees

5-10人

Accepted Payment Currency

USD,CNY

Average Lead Time

45 Day(s)

Certifications

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Product Details

Product Specifications Product Description

Product Specifications

Product Description

Overview

Quick Details

Warranty:: 6monthes

Customized support:: OEM, ODM

Place of Origin:: Guangdong, China

Brand Name:: JF

name:: lead solder paste for SMT welding

Purity:: high purity

melting point:: 227

leading time:: 7 working days

material:: Sn Ag Cu

exter:: brightness

color:: silver white

Usage:: electronic welding

item:: less dross lead bga welding flux

certificates:: RHOS

Certification:: Reach

Supply Ability

Supply Ability:: 100 Ton/Tons per Month

Packaging & Delivery

Company profile :

Shenzhen Jufeng Solder Co.,Ltd is an enterprise specializing the development, production and selling of the soldering tin materials and related chemical products, and its products have been issued with ISO9001:2008 .The company always attaches importance to the R&D of technology and the improvement of quality,has its scientific research institutin,and has gathered a set of senior technicians and managers and established strict management system and perfect quality guarantee system.

Product decription:

Specifications

lead-free tin solder paste is
1.containing halogen good weldability;
2.high residual resistance;
3.melting point lower;

Technical parameters

Model	JF800902	JF800905	JF800903	JF800904	JF800901
Alloy Composition	Sn96.5Ag3.0Cu0.5	Sn99Ag0.3Cu0.7	Sn42Bi58	Sn64Bi35Ag1	Sn63Pb37
Melting Point	217°C	219°C	138°C	139°C	183°C
Powder Specification	25-45mm	25-45mm	25-45mm	25-45mm	20-38mm
Flux Content	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%
Viscosity	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s
Solder ball Test	Qualified	Qualified	Qualified	Qualified	Qualified
Expansion Rate	Qualified	Qualified	Qualified	Qualified	Qualified

Package &delivery:

Product usage:

The Lead Solder Paste is composed of environment-friendly flux and low oxidaton spherical powder,which were characterized by high print definition,excellent solderability and bright and smooth solder joint.

Tin solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

For modern PCB-level electronic assembly using surface mount technology, solder paste is widely used as the joining material. We have made a lot of efforts to develop our solder paste with our own brand .With the aim to satisfy the market requirement and follow the developing tendency of environmental protection, systematical research works are being carried out. We will do our best to provide series of solder paste products marked with our own brand and excellent technical support to promote the cooperation between us.
Lead-free Solder Paste
Alloy Composition
Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58Bi
Lead-Contained Solder Paste
Alloy Composition
Sn63/Pb37 \ Sn62/Pb36/Ag2 \ Sn43/Pb43/Bi14
Sn10/Pb88/A

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