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infrared soldering station zm-r 6200 laser bga rework station ic replacement machine mobile phone repairing tools
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Meo Textile Clothing Co.LTD
China - Hangzhou
Manufacturer
Trade Capacity
Export Percentage
Nearest Port
shanghai,ningbo
Accepted Delivery Terms
Employees
101-200 people
Accepted Payment Currency
USD,CNY
Average Lead Time
60 Day(s)
Certifications
Product Specifications
--Product Description
infrared soldering station zm-r 6200 laser bga rework station ic replacement machine mobile phone repairing tools
infrared bga rework station, mobile phone bga rework station, bga reballing kit
Product description of BGA rework station :
1 | Total power | 4800W Max |
2 | Top heater power | 800W (1st heater) |
3 | Bottom heater power | 1200W (2nd heater) |
4 | 3rd IR heater | 2700W (independent controlling left and right IR heaters) |
5 | power | AC 220V±10 50/60Hz |
6 | Electrical materials | temperature control system Adopted Dalian University of Technology |
7 | Dimensions | 640×630×900mm |
8 | Temperature control | K-type thermocouple (Closed Loop), |
9 | Positioning | V type groove,with universal fixture |
9 | P C B size | Max 410×370mm: Min65×65mm |
10 | Available BGA chip | 1×1~ 80×80mm |
11 | External temperature sensor | 1piece |
12 | Net weight | 65kg |
ZM-R6200 BGA rework station main features:
1. 3 independent heating system
ZM-R62700 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater departly, and combine freely with top and bottom heater’s capacity,to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.
2. Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12” HD monitor.
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12” HD monitor.
3. Multi-function operation system
With touch screen interface, k-type thermocouple, close-loop control, and Intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. it can auto identify a high degree of suction and mounting. with automatic soldering and desoldering functions. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set.
4. Superior safety functions
after finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.
packing &shiping of bga rework station
Skype: jimleebga
tel : 0086 15539152340
demo video:
https://www.youtube.com/watch?v=-c5KopISUUA
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