higher efficiency than 850 smd rework station sp360 bga rework station

1.HT-R490 hot air bga reballing machine
2.hot air IR preheat
3.3 temperature zones
4.for xbox ps3 laptop
5.connect pc

1. With high precision temperature control instrument imported raw materials (PLC). J heater precise control of BGA desoldering process.
2. The machine USES three temperature area independent control, temperature control more accurate.
The first temperature area. The second temperature area all can set 8 paragraph litre (drop) temperature + 8 section temperature control, can also store 10 team temperature curve.
The third temperature area USES far infrared heating board preheat, independent temperature control, ensure the welding process of PCB can comprehensively preheating,
3. The machine has the computer communication function, the built-in PC serial port, external temperature measuring interface, equipped with software, computer control can be realized.
4. Imported high-precision thermocouples, realize the temperature of precision detection.
5. Using upper heating and bottom heating temperature curve way walk alone, cross-flow rapid cooling fan, guarantee the principle in PCB welding process, won't be out of shape.
6. Desoldering and welding finished with alarm functions, equipped with vacuum pen, convenient desoldering suction trip after BGA.
7. PCB positioning of the card slot, v-shaped fissure of flexible and convenient portable universal fixtures, to protect PCB.
8. For big heat capacity PCB and other high requirements, lead-free solder can easily handle.
9. Sirocco can rotate 360 degrees arbitrary time-and-labor-saving, easily replaced. Equipped with a variety of sizes sirocco can be customized tip special requirements.
Suitable for laptop computer motherboard, desktop computer motherboard, etc. Large circuit board maintenance, and mobile phone motherboard such small small-sized chip maintenance.

Note:Please let me know what color that you need before order.

Nozzles----------------------------------------------------X 5 25 x 25, 29x 29, 34x34, 40x40, 50x50;
Aluminium plate for BGA IC reballing---------------- X 1
software---------------------------------------------------X 1
data line -------------------------------------------------- X 1
manual------------------------------------------------------X 1