* Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
PERPORTY | Part A | Part B | |
Colour (Appearance) | White/Black Viscous Liquid | White Viscous Liquid | |
Viscosity, cps , 25℃ | 2500±500 | 2300±500 | |
Density (g/cm³) (GB/T 15223-1994) | 1.52±0.03 | 1.52±0.03 | |
Mixture ratio (Weight Ratio) | A:B = 100:100 | ||
Viscosity of mixture,4#rotor,cps , 25℃ | 2500±1000 | ||
Operation time,mins , 25℃ | 50±10 | ||
Tack free, mins, 25℃ | 90±20 | ||
Cure condition | 25℃/3-5 hr or 70℃/ 50mins, 80℃/ 30mins | ||
Characteristics after curing | |||
Cured appearance | Gray elastomer , Black Elastomer , White elastomer | ||
Hardness, Shore A | 55±5 | ||
Thermal conductivity,W/mK | 0. 65±0.03 | ||
Linear expansion,K-1,ppm | 230 | ||
Dielectric strength ,kV/mm, 25℃ | ≥15 | ||
Volume resistance,DC 500V, Ω·CM | 1.1×1015 | ||
Loss factor(1 MHz) | 0.009 | ||
Dielectric constant(1 MHz) | 3.00 | ||
Application temperature, ℃ | - 60 ∽ 200 | ||
Flame resistance ( UL-94) | V-0 |
Product Model | SI8230 |
Product Name | Fast Curing Thermal conductive RoHs encapsulant potting compound silicone |
Color | White, gray, Black |
Packaging | ² Part A:20 kg/plastic drum Part B:20 kg/plastic drum ² Part A:250 kg/plastic drum Plat B:250 kg/plastic drum |
Shelf life | 12months |
Storage | ● When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance. It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport. |
8230 | Silicon Hydrogen addition type | 1:1,Thermally conductive potting compound, low mixing viscosity, simple operation, used for power supply, string inverter inductance, etc. (replaces DC 8760), hardness 55 shore A Thermal conductivity is 0.75W/m.k, got UL number E489118 | ||||
8230(1.0) | Silicon Hydrogen addition type | 1:1, Thermally conductive potting compound, Low hardening shrinkage,thermal conductivity is 1.0W/m.k | ||||
8230(1.5) | Silicon Hydrogen addition type | 1:1,Soft thermally conductive potting compound, shore A 24, thermal conductivity is 1.5W/m.k | ||||
8230(2.5) | Silicon Hydrogen addition type | 1:1, Thermally conductive potting compound, Low hardening shrinkage,thermal conductivity is 2.5W/m.k | ||||
8230(6#) | Silicon Hydrogen addition type | 1:1,Soft thermally conductive potting compound, good adhesion to most substrates, very low stress after curing, good protection for sensitive components. Not suitable for products without lids (replaces DC EE-3200), hardness is cone penetration (1/10mm awl) 40 thermal conductivity is 0.75W/m.k |