epoxy potting compounds
Description:
uZR112 epoxy casting glue is a room temperature/heating curing epoxy resin glue. ZR112 is used for design, protection of the potting need high strength or confidential electronic products.
uZR112 epoxy potting materials without heating can cure. 4:1 (weight ratio) completely mixed part A and part B, form protection in a period of curing time.
After curing glue has the following characteristics:
uAgainst moisture, dirt and other atmospheric composition
uHigh strength
uHas confidential role
uSolvents, no cure by-products
uFireproof performance
uHave stable mechanical and electrical properties between -45°C-120°C
Conventional performance:
test item | testing standard | unit | A | B |
Outside view | visual inspection | --- | black viscous liquid | Brown liquid |
viscosity | GB/10247-2008 | mPa·s(25°C) | 10000-25000 | 100-150 |
density | GB/T 13354-92 | g/cm3(25°C) | 1.55 | 1.14 |
Operation process:
test item | unit | value |
mixture ratio | weight ratio | 100:25 |
mixture ratio | volume ratio | 100:34 |
Mixed viscosity | mPa·s(25°C) | 1000-2000 |
Mixture density | g/cm3(25°C) | 1.45 |
Gel time | min(25°C) | 40 |
curing time | °C/hr | 80/1.5 or 25/10 |
Operation time is a quantity of cement with 100 g.
A, B two components in proportion to remove mixing ratio, mixing, vacuum suction bubble in operation period, remove the potting products to casting, such as potting product is too big, suggest points potting, then according to The Times curing(80°C/90min or 25°C/10hr)
Operation caution:
uAgent A place for a long time, maybe produce precipitation, mix part A and B access should be paid attention to save after sealing.
uMixing should pay attention to the same direction, otherwise, it will stir with too much bubble; Borders and the bottom of the container sizing material should also stir well, can appear otherwise stir caused by uneven local not curing phenomenon.
uCasting the product vacuum pumping, remove again bubble can improve after curing products comprehensive performance.
uTemperature is too low will lead to curing speed partial slow, heat cure advice; Potting thickness more than 2 cm above 80 °C not directly in the curing, lest cause explosive together.
uThis glue curing exothermic reaction, match the process as the quantity of cement can affect the operation, so the length of time with 100 g resin content of operation time is only a reference time.
Typical performance:
test item | testing standard | Unit | value |
hardness | GB/T 531.1-2008 | Shore D | 80 |
conductivity factor | GB/T 10297-1998 | W/mK | 0.4 |
expansion coefficient | GB/T 20673-2006 | μm/(m,°C) | 44 |
water absorption | GB/T 8810-2005 | 24h,25°C,% | <0.1 |
flame retardant rating | UL-94 | 3mm,105°C | V-0(E315820) |
dielectric strength | GB/T 1693-2007 | kV/mm(25°C) | >20 |
Loss factor | GB/T 1693-2007 | (1MHz)(25°C) | 0.014 |
dielectric constant | GB/T 1693-2007 | (1MHz)(25°C) | 3.53 |
volume resistance | GB/T 1692-92 | (DC500V)Ω· cm | 1.2×1015 |
Remark:All the above data come from 25 °C and 55% RH glue curing conditions after 7 days.
Packing:
25 kg /set; 5kg / set; 1kg/ set
Storage and transportation:
uPart A and part B need to avoid light, heat, save after sealed. (Can be used as the non-dangerous goods transport and storage)
uShelf life Agent A: 1 year, Agent B: 6 months(25°C)