1.PCB Board Processing Capability:
1 | Layers | universal motherboard , 2 to 36 Layer |
2 | Board material type | FR4 |
3 | Compound material lamination | 4 to 6 layers |
4 | Copper Thickness: | 1oz |
5 | Board Thickness: | 1.6mm |
6 | Min. Hole Diameter: | 0.15mm |
7 | Min. Line Width: | 0.1mm |
8 | Min. Line Spacing: | 0.1mm |
9 | Surface Finishing: | HASL lead free |
10 | Solder mask: | Green |
11 | Outer layer copper thickness | 8.75 to 175µm |
12 | Inner layer copper thickness | 17.5 to 175µm |
13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
16 | Hole position tolerance (mechanical drill) | 0.075mm |
17 | Laser drill hole size | 0.10mm |
18 | Board thickness and hole diameter ratio | 10:1 |
19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
20 | Minimum solder mask | Ø0.10mm |
21 | Minimum size of solder mask separation ring | 0.05mm |
22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
23 | Impedance control tolerance | ±10% |
24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.
2.Detailed Terms for PCB Assembly:
Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
Various sizes like 1206, 0805, 0603 components SMT technology | |
ICT(In Circuit Test), FCT(Functional Circuit Test) technology | |
PCB Assembly With UL, CE, FCC, Rohs Approval | |
Nitrogen gas reflow soldering technology for SMT | |
High Standard SMT&Solder Assembly Line | |
High density interconnected board placement technology capacity | |
Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly | |
To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. | |
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
PCBA and enclosure design | |
Components sourcing and purchasing | |
Quick prototyping | |
Plastic injection molding | |
Metal sheet stamping | |
Final assembly | |
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
Custom clearance for material importing and product exporting | |
Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
Reflow Oven: FolunGwin FL-RX860 | |
Wave Soldering Machine: FolunGwin ADS300 | |
Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
PCB Manufacturing Free Support :
1.Guide for components selection: Assistance for type number and specification selection of the main components based on customers’ requests
2. Discussion for schema design: discuss how to make the design based on the components selected. Conquer the difficulties and issues and deal with the questions during the design process together.
3. Rules for PCB layout and routings: help customers making best layout and rules for routings to reduce cost on both time and money
Ourpcb Sulution Provide :
1.Real time control product based on open or close loop, including motor status monitor and control, high-accuracy movement position, remote wire/ wireless transmit and control.
2.Intelligent controller based on automatically control, inculding distributed analog value sampling, solar and wind power generation, charging and inverting products.
3. Rapid Prototyping Device, including 3D printing device control system, Super-power laser control system.
PCB Manufacturing Layout Design Service:
We provide custom-design service for customers who have a product need to be done but know little about the electronic product design. You can just give us the function requests, final cost, environment used and other corresponding information of your product, we can make it out based on your request and provide prototype and design files.