cpu thermal pad High Performance Insulator for Equivalent Of Bergquist Laird Fujipoly

9400F FIBERGLASS Thermal Pad

Product Description:

 9400F materials combines a smooth and highly complaint surface characteristic with high thermal conductivity.

Feature:

• Ultra Soft and High Compressibility;
• 1.6W/m.k Thermal Conductivity;
•  Low Thermal Impedance;
•  Low volatile matter;
• Natural Sticky. 

Application:

Mainly used in higher sensitivity to siloxane electronic components

1101 Series is a product without silicon thermal conductive gaskets, applied to the electronic components of the silica gel is sensitive, with hot melt adhesive as the carrier, adding high thermal conductivity filler, has flexibility and high adhesive ability, more effective joint electronic components and the cooling device, a cooling effect more effectively.

Typical Applications Include:

•  Flat-screen TV, computer, digital camera;
•  Navigation, monitor, led lighting;
•  Measuring instrument, construction machinery,communications equipment

Note:

 Die cutting various shapes according to customer requirements