carbon conductive paste OEM/ODM
1 bonding wafer/chip to the PCB
2 good adhesion on ceramic/metal/plastic
3 EL, FPCB,ITO(PET+alumina/glass)
4 membrane switch
WTS-5100 conductive silver paste (best-selling product)
Description
Especially, it’s suitable for bonding the chip to the PCB or other conductive device.
low viscosity, low thixotropic rate ,excellent adhesion to ceramic, metal and plastic
How to use
Defrost: place it aside at room temperature first for 2 to 4 hours until
its temperature is close to the room temperature before using.
Use: By hand or dispensing device
Cure: 130°C about 60 mins, 150°C about 40 mins.
Technical data
Viscosity | 400~500Pa·s |
Color | Silver gray |
Operating time at 25°C | about 24 hours |
Working temperature | -60°C ~175°C |
Hardness | Shore 85D |
Metamorphic temperature | >350°C |
Solid content | >82% |
Water absorption after boiling 2 hours | <1.0% |
Volume Resistance | 2.5mΩ/mm2 |
Thermal conductivity | >2 W/(m·K) |
Wafer shear strength(Si to Ag)@25°C | 1*1mm Wafer clip strength ≥350G |
Glass transition temperature (DMA-onset) | 115°C |
TMA Thermal conductivity | Alpha one: 45 ppm/°C |
Alpha two: >135 ppm/°C | |
Evaporability TGA | Weight loss upon cure : <2.0% |
Weight loss at 250°C: <0.2% | |
Ion properties | |
Ammonium ion | <20ppm |
Chloride ion | <50ppm |
Sodium ion | <5ppm |
Potassium ion | <5ppm |
Storage & shelf life | Store at -5 ~ 5 °C,6 months |
Other related conductive silver paste product
Guide
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7 packing? we have the package of syringe or plastic bottle
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