ITEM | Capability |
Layers | 1-22 |
Thicker Copper | 1-6OZ |
Products Type | HF(High-Frequency)&(Radio Frequency) board, lmpedance controlled board. HDl board.BGA& Fine Pitch board |
Solder Mask | Nanya&Taiyo; LPl & Mattgreen,yellow,white,blue,black,red. |
Base material |
FR4(Shengyi China, ITEQ, KBA+,HZ), Hl-TG. FR06,Rogers Taconic, Argon, Nalco, lsola, aluminum and so on |
Finished Surface | HASL.Lead-free HASL.Falsh Gold, ENIG(Immersion Gold). OSP, lmmersion Tin.lmmersion Silver,Hard Gold |
Technical Specification |
Minimum line width/gap:3.5/4mll(laserdrill) Multilayers:0.40-4.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 8: 1 |