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Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
  • Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
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Product Description
Overview
Quick Details
Place of Origin:
Guangdong, China
Brand Name:
XINST
Model Number:
Xinst 0611-15
Adhesive:
Silicone
Adhesive Side:
Double Sided
Adhesive Type:
Pressure Sensitive
Design Printing:
No printing
Material:
Polyimide
Feature:
Heat-Resistant
Use:
MASKING
SIZE:
Customized
Thickness:
0.15mm
Supply Ability
Supply Ability:
50000 Piece/Pieces per Week
Packaging & Delivery
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Products Description
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
Pyrolysis thinning film, called positioning slitting styrofoam in the industry, also known as hot peeling tape/cutting film/mlcc cutting film, etc., before being heated, it is pasted on the surface of the object, which can play a good role in the object. The function of protection and shielding can be easily debonded after the thermal process, so that the processed parts can be easily/easy peeled off without leaving residual glue, which is conducive to automation, saves manpower/material resources, and improves efficiency.

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape Applications:

Used in delicate and fragile wafer processing; positioning and cutting in the process of MLCC chip capacitors and chip inductors; semiconductor wafer surface processing; electronic and optoelectronic industrial components manufacturing and processing engineering; LCD and TP touch panel glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and polishing process; copper substrate graphene (Graphene) transfer and carbon nanotube transfer applications, which can replace UV blue film.

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs. Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs. Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production. Foaming peeling time: 10 seconds-3 minutes. Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.

Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Die cutting tapes enable you to save a significant amount of time when applying the adhesive tape and to save money for cuts through slitting.



Our Factory Competitive Advantages: Well Competitive Prices and High Quality Control Prompt Delivery Earth-friendly Products In a Variety of Design Small Order Acceptable OEM Accepted Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm,standard length:50M OEM Size:Special length, thickness or combinations can be supplied per customer’s request.Products can be supplied in roll,tape,sheets or shapes per customer’s request.Only you provide the CAD drawing,we can die cut any size for you. Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton
Specification
Product Name
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
Adhesive Type
Foaming adhesive
Color
white/blue/yellow
Temperature Resistance
-20°C -130°C
Before foaming
4.0N/20mm
After foaming
0.02N/20mm
Features
* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates. 
* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage. 
* Provides a high processing accuracy since substrates are kept in a fixed position. 
*Three types (rolls, labelers and sheets) are available. 
* Environmentally friendly since no cleaning is required for substrates.
Thickness
0.15mm
For more
Please don't hesitate contact our service.
Products Show
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Packing & Delivery
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Our Services
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Company Information
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape from China supplier

FAQ

1)How to order from xinst?
Just send us email or call us.

2)Do you offer the free sample for testing?
Yes, we offer the sample free, but you courier charges.

3)How to ship the order?
We will suggest you the appropriate way of shipment, by sea, by air or by courier. Of course if you will have your own forwarder,that is no problem.

4)Can we trust the quality of product from Xinst?
Sure, do not worry about that. Our quality wills absolutely compliance to the sample we send. If not, we will take charge of that.

5)What payment Xinst accepts?
For the small quantity, we request 100% advanced TT payment; other conditions, negotiable. Sorry, we did not accept the Credit card for the time being.

6)How about the lead time of per order?
If the tape you order have stock, we can ship out within 1~3 days. If there is no stock, you need to wait about 5~12 days. If you are request the die-cuts, the time shall longer.

Friendly Tips:
If you find our tapes interested, please send your detailed requirements to us. Xinst’s team would offer different solutions to you within 12 hours. Free samples are also available.
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ToLily Liu
Meorient Import & Export Co.LTD
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