*Through its special surface cardboards, it allows having a smooth surface and provide excellent base for ceramic and tile coating or prior to a variety of decorative applications by use of Board & Wall Cement Based adhesive mortar.
*It minimizes problems arising from handling, application and use due to its high resistance,
*As a ‘breathable’ material, it balances the ambient humidity and helps formation of healthy environments.
*As it is water repellant with low level of water absorption, it allows using at the wet areas and helps to prevent water leakage.
*Besides being easy to prepare, apply and disassemble, it helps saving time and labor, permitting to pass the installation and insulation materials through the application cavities.
*Compared to the conventional wall applications, it considerably decreases the building wall loads and reduces the beam, column and slub sizes, thus minimizing the construction costs.
*It should not be applied under conditions at 40C and below.
*The application should be made by auxiliary materials which should be in accordance with the standart.
*For partition wall applications, maximum framing spacing should be 60 cm. in dry condition. Incase of wet area, high wall and load bearing application, the framing spacing should be reduced down to 30cm. Depending on the conditions, DC profile width should be increased.
*For ceiling applications, the profiles are connected to the board direction as a parallel, the framing spacing should be 40 cm., If the connection is vertical, It should be 50 cm
*When high level sound and thermal insulation is required, it should be used together with proper insulation material. For ceiling application, you should use extra fastening components.
*Any damaged board and auxiliary materials should be renewed and application should not be made by any defective materials.