1.100% IQC check for all material incoming
2..Factory used ERP system to control lead time and quality , customer drawing (with size and spec.) will come with lot card on online board.
3. All Inner layer will do 100% AOI , and use plastic sheet between core to avoid scratch .
4.After lamination board we will do a cross section to Test board thickness and dielectric thickness .
5.On drill hole process , we use hole film to compare the board to Avoid hole missing or hole too big
6.On process , we would do cross section to Make sure hole wall copper .
7.For outer layer circuit , we do 100% AOI checking . for HDI board ,we would test board before solder mask
8. On solder mask process , we have inspect the board solder mask 100% .
9.100% to testing finished board , if there is impedance control , we will do impedance control.
10. For production board , we would do first article board first .