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Thermal Pad | ||||||||
Sheen Pad Series | Thermal conductivity | Thickness | Dielectric Breakdown Voltage (KV/AC/mm) | Hardness (Shore 00) | ||||
1.5 W/mk | 0.15~10 mm | >5KV/AC/mm | 30-90 Shore 00 | |||||
2.0W/mk |
0.15~10 mm
|
>5KV/AC/mm
| 35-90 Shore 00 | |||||
2.5 W/mk |
0.15~10 mm
|
>5KV/AC/mm
| 35-90 Shore 00 | |||||
3.0 W/mk |
0.25~10 mm
|
>5KV/AC/mm
| 30-90 Shore 00 | |||||
3.5 W/mk |
0.25~10 mm
| >5KV/AC/mm
| 35-90 Shore 00 | |||||
4.0W/mk | 0.5 ~ 5.0mm | >5KV/AC/mm | 30~90 Shore 00 | |||||
5.0W/mk |
0.3~10 mm
|
>5KV/AC/mm
| 60-90 Shore 00 | |||||
6.0 W/mk |
0.5~10 mm
|
>5KV/AC/mm
| 60-90 Shore 00 | |||||
7.0W/mk | 0.5 ~ 5.0mm | >5KV/AC/mm | 50~80±5 Shore 00 | |||||
8.0W/mk |
0.5~10 mm
|
>5KV/AC/mm
|
50~80±5 Shore 00
| |||||
10.0 W/mk |
0.5~10 mm
|
>5KV/AC/mm
|
55±5 Shore 00
|
Product Name | Thermal Pad | ||
Item No. | SF400 | Test Method | |
Color | Gray,Yellow | Visual | |
Main ingredients | Silicone | ||
Thickness (inch/mm) | 0.15-10mm | ASTM D751 | |
Density(g/cc) | 2.7 | ASTM D297 | |
Hardness(shore A) | 35-90 | ASTM D2240 | |
Tensile Strength | 40psi | ASTM D412 | |
Fire Rating | UL94 V0 | Equivalent UL | |
Breakdown voltage(V) | >2500(Thickness≥0.02″) >4500(Thickness≥0.03″) | ASTM D149 | |
Volume Resistivity (TΩ.cm) | 1.0 X 1013 | ASTM D257 | |
Dielectric Constant (1M HZ) | 6.0 | ASTM D150 | |
Thermal Conductivity (W/m k) | 2.5 | ASTM D5470 | |
Service Temperature | -58 to 392 °F -50oC ~ 200oC | *** | |
Introduction | The SF400 products are mostly used for heat sink, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. the method of lubricating grease and mechanical fixing. | ||
Features and Benefits | 2.5 W/m-K Thermal Conductivity High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape High performance, thermally conductive acrylic Adhesive Withstand heat variation long term | ||
Typical Applications Include | -LED lighting -Cooling Components to the Chassis, Frame, or other type of heat spreader - Mass Storage Drives - Heat Pipe assemblies - RDRAM Memory Moduies - High Frequency Microprocessors - Notebook and Desktop PCs |
Tel | +86-769-22479425 | Address | 6th Floor, Building M, Jinxiongda Science and Technology Park, Datanglang Villiage, Dalingshan Town, Dongguan City, Guangdong Province, China |
Fax | +86-769-82784017 | ||
Web | http://sheen.en.alibaba.com/ http://www.usheenthermal.com/ | E-Mail Address | tina@u-sheen.com |