Sn96.5Ag3.0Cu0.5 Lead Free RoHS Compliant Solder Bar / Solder Stick
1. Features:
2. Specification:
Specification | Sn99-Ag0.3-Cu0.7 | |||||||||
Appearance | Lucent, no dirt on surface | |||||||||
Packing | G.W.: 500g/roll, 10kg/ctn. | |||||||||
Chemical Components | ||||||||||
Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
Residue Content | 0.3±0.1 | 0.7±0.2 | <0.1 | <0.1 | <0.06 | <0.001 | <0.02 | <0.001 | <0.03 | <0.002 |
Alloy Component | Melting Point, ℃ | Tensile Strength, g/cm3 | Rigidity HB | Heat Conductivity M.S.K | Tensile Strength, MPa | Elongation Rate, % | Electric Conductivity, % |
Sn99Ag0.3Cu0.7 | 230 | 7.4 | 9 | 64 | 32 | 48 | 16.0 |
3. Product display: