SMT Manufacturing Capability | ||||||
Item | Manufacturing Capability in process | Manufacturing Method | ||||
Production size(Min/Max) | 50×50mm / 500×500mm | |||||
Production board thickness | 0.2 ~ 4mm | |||||
Printing solder paste | Support method | Magnetism fixture, vacuo platform | ||||
Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board | ||||||
Cleaning Method of printing solder paste | Dry method+ wetting method+ Vacuo method | |||||
Accuracy of printing | ±0.025mm | |||||
SPI | Repeated accuracy of volume | <1% at 3σ | ||||
Mounting component | Components size | 0603(Option) L75mm Connector | ||||
Pitch | 0.15mm | |||||
Repeated accuracy | ±0.01mm | |||||
AOI | FOV size | 61×45mm | ||||
Test speed | 9150mm²/Sec | |||||
3D X-ray | Shootingangle | 0-45 |
Rigid RPCB Manufacturing Capability | ||||
Item | RPCB | HDI | ||
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) | ||
minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) | ||
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) | ||
minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) | ||
maximum aspect Ratio (thickness/hole diameter) | 10:1 | 8:1 | ||
impedance control accuracy | +/-8% | +/-8% | ||
finished thickness | 0.3-3.2MM | 0.2-3.2MM | ||
maximum board size | 630MM*620MM | 620MM*544MM | ||
maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) | ||
minimum board thickness | 6MIL(0.15MM) | 3MIL(0.076MM) | ||
maximum layer | 14层 | 12层 | ||
Surface treatment | HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag | Immersion Gold、OSP、selectiveimmersion gold、 carbon print | ||
Min/max laser hole size | / | 3MIL / 9.8MIL | ||
laser hole size tolerance | / | 10% |