PCB Layers | 1-24 Layers | Min Soldermask bridge | 0.076mm |
Max Panel Size | 600mmx600mm | Insulating resistance | 1E+12Ω(general) |
Min Board Thickness | 4 Layers 0.40mm, 6 Layers 0.80mm, 8 Layers 1.00mm, 10 Layers 1.20mm | Board Thick : hole size | 0.209027778 |
Min Trace Width | 0.075mm | Shock heating | (3 times/10 second) |
Min Trace Space | 0.075mm | Wrap & twist | ≤0.7% |
Min Hole Size | 0.20mm | Electric strength | >1.3KV/mm |
Hole wall thickness | 0.025mm | Peel strength | 1.4N/mm |
Tolerance For PTH hole | ±0.076mm | solder mask hardness | ≥6H |
Tolerance For NPTH hole | ±0.05mm | Flammability | 94V-0 |
Hole position tolerance | ±0.05mm | Impedance control | ±5% |
Tolerance for outline | ±0.15mm | Surface treatment | OSP, HASL, ENIG, Immersion tin, Immersion silver |
Board Size | Board machine SMT size 40*50 mm |
SMT+DIP | Machine SMT and through-hole assembly |
BGA part | Able to process 0.35 pitch micro BGA, AQFN, QFP, QFN, & AQFN (advanced quad flat no-leads) |
Quantity | Up to 100,000 pieces quick SMT machine per day |
Quality check | AIO and X-RAY automatic check |
Clean requirement | Clean or not-clean process |
ROHS requirement | RoHS / Non-RoHS compliant assembly |
Components | 100% Material procurement, 100% consigned material management or hybrid |
Testing | Flying Probe Testing 100%, Voltage test, Test fixture, Function test, Software test etc |
Lead time | Sample order ~2wks, small batch production ~3wk, mass production ~4wks |