rtv silicone potting sealant
Description:
ZR341 High thermal conductivity organic silicon encapsulating gum is a room temperature/heating curing and molding organic silicone materials. This kind of two-component elastic silicone potting, designed to protect in harsh conditions of electronic products.
ZR341 High thermal conductivity organic silicon encapsulating glue used new technology without heating, would be curing. When used according to 1:1 (weight ratio or the volume in the thorough mixing proportion of A and B two components, products will be in A certain time, form of the elasticity of curing buffer material.
After curing, has the following characteristics:
u Against moisture, dirt and other atmospheric composition
u Relieve mechanical, thermal shock and vibration of mechanical stress and tension caused
u Easy to repair
u High frequency electric performance
u No solvents, no cure by-products
u Have stable mechanical and electrical properties between -50°C-200°C
u Excellent flame retardancy
Conventional performance:
testing Item | testing standard | unit | A | B |
Outside view | visual inspection | --- | Black viscous liquid | White viscous liquid |
viscosity | GB/T 10247-2008 | mPa·s(25°C) | 5500±1500 | 5000±1500 |
density | GB/T 13354-92 | g/cm3(25°C) | 1.85±0.05 | 1.85±0.05 |
Operation time is a quantity of cement with 100 g.
A, B two components in proportion to remove, stir to mix evenly, vacuum suction bubbles in operation period, remove the need of the potting casting products, if the potting product is too big, can divide times, then potting according to (60 °C / 30 min or 25 °C / 10 hr) can be cured.
Operation caution:
u Agent A place for a long time, maybe produce precipitation, mix part A and B access should be paid attention to save after sealing.
u Mixing should pay attention to the same direction, otherwise, it will stir with too much bubble; Borders and the bottom of the container sizing material should also stir well, can appear otherwise stir caused by uneven local not curing phenomenon.
u Casting the product vacuum pumping, remove again bubble can improve after curing products comprehensive performance.
u Temperature is too low will lead to curing speed partial slow, heat cure advice; Potting thickness more than 2 cm above 80 °C not directly in the curing, lest cause explosive together.
u ZR341 with contain N, S, P element of compounds and some heavy metal ion compounds, will appear difficult contact curing or not curing phenomenon. These heavy metal ions including Sn, Pb, Hg, Bi, As, etc.
Typical performance:
Testing item | testing standard | unit | value |
hardness | GB/T 531.1-2008 | Shore A | 55±5 |
conductivity factor | GB/T 10297-1998 | W/mK | 1.2 |
expansion coefficient | GB/T 20673-2006 | μm/(m·°C) | 230 |
water absorption | GB/T 8810-2005 | (24h,25°C) % | 0.01-0.02 |
dielectric strength | GB/T 1693-2007 | kV/mm(25°C) | >25 |
Loss factor | GB/T 1693-2007 | (1MHz)(25°C) | 0.01 |
dielectric constant | GB/T 1693-2007 | (1MHz)(25°C) | 2.8 |
volume resistance | GB/T 1692-92 | (DC500V)Ω·cm | 1.2×1015 |