Suitable for IC chips, integrated blocks and dual in-line, etc. Components, can quickly separate components from the circuit board. The material is heat-treated to ensure elasticity and resistance to deformation 1. The DIP can be easily removed from the substrate without damaging any IC conductors. Available on SOCKET or PCB,pick up ICs in PLCC, PGA, PCLL, and DIP packages. 2. Use the handshake method to pull the IC up steadily in the vertical direction (not forcibly pull up), and pull it out.The IC can get a complete PIN. 3. The densely arranged ICs can be pulled out directly without moving other ICs. 4. ICs of different sizes within 5.5cm of the contact surface can be pulled out in a very short time, easy to operate And it saves effort. |