*It should not be applied under conditions at 40C and below.
*The application should be made by auxiliary materials which should be in accordance with the standart.
*For partition wall applications, maximum framing spacing should be 60 cm. in dry condition. Incase of wet area, high wall and load bearing application, the framing spacing should be reduced down to 30cm. Depending on the conditions, DC profile width should be increased.
*For ceiling applications, the profiles are connected to the board direction as a parallel, the framing spacing should be 40 cm., If the connection is vertical, It should be 50 cm.
*When high level sound and thermal insulation is required, it should be used together with proper insulation material. For ceiling application, you should use extra fastening components.
*Any damaged board and auxiliary materials should be renewed and application should not be made by any defective materials.
Strongly packaged and palletized.
Megaturk Co. LTD, Istanbul - TURKEY