Layers |
1-16 layers |
Min Board Thickness(2-layer) |
0.2mm |
Max Board Size |
635 × 1100mm |
Min Board Thickness(4-layer) |
0.6mm |
Min Board Size |
20 × 30mm |
Min Inner-layer Thickness |
0.1mm |
Min Trace |
0.1mm |
Min Annular Ring |
0.1mm |
Min Space |
0.1mm |
Min Hole Location Tolerance |
±0.075mm |
Min Hole Size |
0.2mm |
Min Hole Size Tolerance |
±0.05mm |
Board Warp |
≤ 1° |
Min Outer Dimension Tolerance |
±0.1mm |
Solder Mask |
Green, Yellow, Red, Black, Blue, White |
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Surface Finish |
HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP |
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Board Material |
FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based, Rogers, Taconic |
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Acceptable file |
Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWER PCB,AutoCAD,ORCAD |
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CAM software |
Genesis, CAM350 |
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