Base Material | Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc. | | | |
Solder Mask Color | Green, Red, Blue, White, Yellow, Purple, Black | | | |
Legend Color | white, yellow, black, red | | | |
Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver | | | |
Max. layer-up(L) | 50 | | | |
Max. unit size (mm) | 620*813 (24"*32") | | | |
Max. working panel size (mm) | 620*900 (24"x35.4") | | | |
Max. board thickness (mm) | 12 | | | |
Min. board thickness(mm) | 0.3 | | | |
Board thickness tolerance (mm) | T<1.0mm: +/-0.1mm; T≥1.0mm: +/-10% | | | |
Registration tolerance (mm) | +/-0.10 | | | |
Min. mechanical drilling hole diameter (mm) | 0.15 | | | |
Min. laser drilling hole diameter(mm) | 0.075 | | | |
Max. aspect（through hole) | 15:1 | | | |
Max. aspect（micro-via) | 1.3:1 | | | |
Min. hole edge to copper space(mm) | L≤10, 0.15；L=12-22,0.175；L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 | | | |
Min. innerlay clearance(mm) | 0.15 | | | |
Min. hole edge to hole edge space(mm) | 0.28 | | | |
Min. hole edge to profile line space(mm) | 0.2 | | | |
Min. innerlay copper to profile line sapce (mm) | 0.2 | | | |
Registration tolerace between holes (mm) | ±0.05 | | | |
Max. finished copper thickness(um) | Outer Layer: 420 (12oz) Inner Layer: 210 (6oz) | | | |
Min. trace width (mm) | 0.075 (3mil) | | | |
Min. trace space (mm) | 0.075 (3mil) | | | |
Solder mask thickness (um) | line corner : >8 (0.3mil) upon copper: >10 (0.4mil) | | | |
BGA pad (mm) | ≥0.25 (HAL or HAL Free：0.35) | | | |
V-CUT blade position tolerance (mm) | +/-0.10 | | | |
Impedence tolerance (%) | +/-5% | | | |
Min. legend width (mm) | 0.1 | | | |
Fire flame calss | 94v0 | | | |
