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New WDS-700 bga rework station automatic for iphone xiaomi samsung HTC all brand mobile motherboard repair
  • New WDS-700 bga rework station automatic for iphone xiaomi samsung HTC all brand mobile motherboard repair

New WDS-700 bga rework station automatic for iphone xiaomi samsung HTC all brand mobile motherboard repair

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--
Product Description
Overview
Quick Details
Place of Origin:
Guangdong, China
Brand Name:
Fundar
Model Number:
WDS-700
Voltage:
110V/220V
Current:
Dependable
Rated Capacity:
2500W
Dimensions:
590*590*710mm
Usage:
BGA Rework Station
After-sales Service Provided:
Engineers available to service machinery overseas
Superior function:
Auto soldering desoldering mounting BGA/IC
Power supply:
AC 220V±10% 50/60Hz
Total power:
Max 2500W
Heater power:
Upper temp.zone 1200W,Down temp.zone 1200W
Electrical material:
Driving motor+ smart temp.controller+color touch screen
Locating way:
V shape slot,PCB support jigs can adjust
PCB size:
Max 200*200mm Min 5*5 mm
Applicable chips:
Max 80*80mm Min 1*1 mm
Overall dimension:
L450*W470*H670mm
Warranty:
12 Months
Type:
Other
Certification:
CE
Weight:
50kg
Supply Ability
Supply Ability:
1000 Set/Sets per Month
Packaging & Delivery

New WDS-700 bga rework station automatic for iphone xiaomi samsung HTC all brand mobile motherboard repair

 

 

Product Description

 

 

Special for mobile phone motherboard samsung iphone xiaomi huawei etc.

 

Features:

Independent 2 heating zones temperature control system 

1. The upper and lower heating zone,temperature precision control within ±1℃. which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently.

2. Hot air district heating for BGA and PCB at the same time,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.

3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;

4. temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.

 

Precision optical alignment system

WDS-700 Using high definition and adjustable CCD color optical alignment system,beam split, amplification, lessening, fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast; equipped with 15 ” high definition LCD monitor. 

 

Multi-functional and humanized operation system

1. Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.

2. X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.

 

Superior safety protection function

WDS-700 With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.

 

 

Specifications

 

Superior function

Auto soldering desoldering mounting BGA/IC

Power supply

AC 220V±10% 50/60Hz

Total power

Max 2500W

Heater power

Upper temp. zone 1200W, Down temp. zone 1200W

Electrical material

Driving motor+ smart temp. controller+color touch screen

Temperature controlling

(high precision K-sensor)(Closed Loop), independent temp. controller, the precision can reach ±1

Locating way

V shape slot, PCB support jigs can adjust

PCB size

Max 20200mm Min 5×5 mm

Applicable chips

Max 80×80mm Min 1×1 mm

Overall dimension

L450×W470×H670mm

Temperature Interface

1 pcs

Color

Blue+White

Package size

590*590*710mm

Package Weight

50kg

 

 

 

Packaging List

 

1 x WDS-700 BGA Rework Station

 

 

Detail Images

 

 

 

 

Company Information

 

 

Contact Us

 

Tel:0086-755-83972411
Cell phone:+86-13714418508

Skype:+86-13714418508

Lisa Fundar

Wechat:+86-13714418508
WhatsApp:+86-13714418508

  

 

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