Specifications

· Infrared Reflow Oven Model: T-962A+ 

· Rated Power: 2300W 

· Effective Soldering Max Area: 370 x 450 mm (14.5 x 17.7 inches)

· Power Supply: AC110V/60Hz 

· Temperature Range: 0℃-350℃ 

· Cycle Time: 1~8 min 

· Rated Duty Cycle: 100% 

Package Content

· 1 x T-962A+ Reflow Oven 

Great Performance 

The reflow machine adopts fast infrared radiation and smooth wind circulation so the temperature is very accurate and even. Parameters of Eight (8) Soldering cycles are predefined. Thermal cycle accuracy is maintained by closed-loop micro-computer control with infrared heaters, thermocouple, and circulating air. 

Wide Welding Area 

A wide working area of 370 x 450 mm, thus allowing it to work under different working conditions, making it an all-in-one device you want, large welding area for high efficiency. This increases the usage range of this machine drastically and makes it an economical investment. 

Excellent Smoke Vent

This high-efficiency cooling system, including one smoke vent, is to ensure the rapid cooling of the product. Meanwhile, it offers low temperature which is required when PCB board releases. Therefore, the process can be completed with safety and efficiency you need.(The pipeline is not included) 

LCD Screen 

Complete visual operation by the high-quality LCD screen. Soldering cycles are keypad selected and progress displayed on the T962A+. 

Automatic Control 

Automatic microcomputer control. The entire soldering process can be completed automatically from Preheat, Soak, and Reflow through cool- down. 

Wide Application 

This infrared reflow oven can be used for the glue solidifying, circuit board thermal aging, PCB maintenance, etc; it also can solder single and double PCB panels with all kinds of encapsulation forms such as CHIP, SOP, PLCC, QFP, BGA, etc.