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Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink
  • Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink

Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--
Product Description
Overview
Quick Details
Temper:
Soft
Use:
Insulation Material
Treatment:
Coated
Type:
Die Cut Piece
Alloy:
Alloy8011, 8011-O
Thickness:
0.050~0.150mm
Place of Origin:
Guangdong, China
Brand Name:
OEM
Model Number:
HMR
Product Name:
Aluminum Foil Sheet
Color:
Black
Hardness:
0.05~0.15mm
Adhesive:
Acrylic
Size:
Customized Size
Length:
50~100m
Thermal conductivity of composite layer:
300~600 W/mk
Base heat conductivity:
200 W/mk
Supply Ability
Supply Ability:
10000 Meter/Meters per Week
Packaging & Delivery

Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink

ItemHMR20050BHMR25050BHMR20050BHMR50050BHMR50100BHMR50130BHMR
100150B
Total thickness(mm)0.050.050.070.0850.10.130.15
Size(width X length)520mm*50M/100M (≤T0.04); 620mm*50M/100M (≤T0.05);
Substrate thickness(mm)0.0250.0250.020.050.050.050.1
AdhesiveAcrylic
ColourBlack
Tube core3.0’’(76.0)
Adhesion to Stainless seel(Kgf /25.4*25.4)≥1.0≥1.20≥1.20≥1.20≥1.50≥1.50≥1.50
Adhesion to Al foil(Kgf /25.4*25.4)≥1≥1.20≥1.20≥1.20≥1.50≥1.50≥1.50
Viscous force≥2#≥2#≥2#≥2#≥2#≥2#≥2#
hear Strength(1 inch)8H12H12H12H24H24H24H
Temperature resistanceLong Term (days, weeks)               80℃
Temperature resistanceShort Term (minutes, hours)             120℃
Surface resistanceNA
Base heat conductivity200 W/mk
Thermal conductivity of composite layer300~600 W/mk
UV ResistanceMedium
Shelf lifeForm 12 months from date of manufacture when stored in original cartons at 10-25℃and 30-70% relative humidity.

 

 

1. For dimensional stability and improved handling with ease of die cutting and laminating;

2. The high adhesion adhesive provides excellent adhesion to a variety of surfaces;

3. High thermal conductivity, shielding , flexibility, machinability ,Temperature resistance properties;

4. Meet ROHS and UL environmental requirements.

1. Intelligent mobile phone

2. Notebook computer

3. tachograph

4.Precision instrument

5.Other parts that need to conduct heat

Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink from China supplier

 

Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink from China supplier 

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ToLily Liu
Meorient Import & Export Co.LTD
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