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Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit
  • Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit

Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
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Product Description
Overview
Quick Details
Model Number:
CJD-FPC
Place of Origin:
Guangdong, China
Brand Name:
CJD
Base Material:
FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness:
0.4-2mil(10-50um)
Board Thickness:
0.2-6mm
Min. Hole Size:
0.1mm(4mil)for HDI / 0.15mm(6mil)
Min. Line Width:
0.075mm/0.075mm(3mil/3mil)
Min. Line Spacing:
0.075mm/0.075mm(3mil/3mil)
Surface Finishing:
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
Board Size:
Custom
Assembly Service:
SMT Service
Color:
White Black Red Yellow
Testing Service:
100% Electrical Test
Layer:
2-32 Layer(flex Board)
product name:
Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit
Packaging & Delivery

Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit

Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit

Molex Print Membrane Keyboard Witch Cable 0.4mm Pitch Printed Pcb Flex Fpc Flexible Flat Circuit from China supplier

Product Description

 

Main Technique Index:

Description Parameters
Polyimide Polyester
Base film thickness (μ m) 12.5/25/35/50 12.5/25/35/50
Copper thickness (μ m) 12/17.5/35/50/70/105
Min line width/Line space (mm) 0.075
Min hole size (mm) 0.15

Tolerance (mm)

Outline ± 0.05 / Coverlay ± 0.2

Peel Strength (Kgf/cm) Above 1.0 Above 0.8
Solder Resistance

260℃ 10s(Second)

204℃ 5s (Second)

Surface Treatment:

Surface Treatment Thickness
Hot Air Leveling (H.A.L) 5-20 μm
Entek/O.S.P 5-20 μm
Ni/Au Plating NI : 3-9 μ m  AU : 0.03-0.1 μ m
Immersion Tin NI : 3-5 μ m  AU : 0.03-0.1 μ m
Tin Plating 3-7 μ m

 

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Meorient Import & Export Co.LTD
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