Module Accessories Assembly Mobile Power Bank 12v Battery Charger Pcb Board
parameter
Item | Description | Capability |
Material | Laminate Material | FR4 (LF/High Tg), CEM3, CEM1, Alu, Rogers |
Board Cutting | Number of Layer | 1 to 20 |
Min. Thickness_inner Layer | 0.003" (0.07mm) | |
Board Thickness | Standard | 0.04-0.16”±10% (0.1-4mm±10%) |
Min. | 4/8 layers: 0.01±0.008” | |
Bow & Twist | <7/1000 | |
Copper Weight | Outer | 0.5-4 oz |
Inner | 0.5-3 oz | |
Drilling | Min Size | 0.0078” (0.2mm) |
Drill Deviation | ±0.02” (0.05mm) | |
PTH/NPTH Hole Tolerance | ±0.002” (0.005mm) | |
Plating | Min Hole Size | 0.0008” (0.02mm) |
Aspect Ratio | 20 (5:1) | |
Solder Mask | Color | Green, White, Black, Red, Blue... |
Min Solder Mask Clearanace | 0.003” (0.07mm) | |
Thickness | 0.0005-0.0007”(0.012-0.017mm) | |
Silkscreen | Color | White, Black, Yellow, Red, Blue... |
Min Size | 0.006” (0.15mm) | |
E-test | Flying Probe Tester | Yes |
Controlled | Tolerance | ±10% |
Surface Finish | HASL, ENIG, Immersion Gold/Silver/Tin, OSP... |
SMT(Surface Mounting technology):
1. Parts procurement(for turnkey orders)
2. Parts verification & kit preparation
3. Paste stencil fabrication
4. SMT Assembly \ THT Assembly (wave solder if applicable)
5. Complex pcb assembly
6. 100% AOI and X-Ray testing
7. The firmware burned in the MCU & programming
8. ICT testing and Function testing as requested
9. PCB Conformal coating
10. RoHS compliant lead-free assembly
11. Rapid prototyping
12. Cable Assembly & Wire Harnesses
13. Mold making / plastic injection molding
14. Final box-build assembly & packing services
15. OEM/ODM also welcomed