The laptop high cooling thermal insulation pad is silicone based thermal pad which has been designed for both efficient heat transfer away from critical devices and ease of manufacturing. It can also be provided in a range of formats and thickness, such as sheets, rolls and die cut parts. The laptop high cooling thermal insulation pad offers a good combination of low thermal impedance, good compressibility and a high dielectric breakdown voltage.
Metric Value | |||||||||
Property | Test Method | Unit | LD8100 | LD8150 | LD8200 | LD8250 | LD8300 | LD8400 | LD8500 |
Color | Visual | - | Light Grey | Dark & Grey | Red | Yellow | Blue | Light Blue | Light Green |
Thickness | ASTM D374 | mm | 1.0~2.5 | 0.5~20.0 | 0.5~20.0 | 0.5~5.0 | 0.3~20 | 0.5~5.0 | 1.0~5.0 |
Density | ASTM D792 | g/cc | 2 | 2.5 | 2.8 | 3.0 | 2.7 | 3.2 | 3.4 |
Hardness | ASTM D2240 | Shore C | 15±5 | 25±5 | 25±5 | 25±5 | 30±5 | 40+/-5 | 45±5 |
Tensile Strength | ASTM D412 | KN/m | 2.5 | 0.47 | 0.33 | 0.42 | 0.29 | 0.12 | 0.15 |
Continuous Use Temp. | EN 344 | °C | -40-150 | -40-150 | -40-150 | -40-150 | -40-150 | -40-200 | -40-200 |
Electrical | |||||||||
Breakdown Voltage | ASTM D149 | Kv/mm | ≥6.3 | ≥5.2 | ≥6.0 | ≥5.3 | ≥4.8 | ≥6.0 | ≥4.0 |
Volume Resistivity | ASTM D257 | Ω.cm | 6.2×1015 | 8.0×1015 | 1.0×1016 | 3.2×1016 | 3.2×1016 | 1.0×1012 | 1×1012 |
Flame Rating | UL 94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
Thermal | |||||||||
Thermal Conductivity | ASTM D5470 | W/m.k | 1.0 | 1.5 | 2.0 | 2.5 | 3.0 | 4.0 | 5.0 |
Remark: Data for design engineer spec. reference only. Engineers are reminded to test the material in application.
Leader OPUS strives to provide the reliable thermal interface materials for customers. In order to meet today’s thermal management demands, spanning markets as diverse as home appliances to handheld technologies. We improve our R&D department with the aim to provide the great laptop high cooling thermal insulation pad to effectively control the heat.