1.SMT, PTH, mixed technology
2.SMT: 2,000,000 solder joints per day
3.DIP: 300,000 joints per day
4.Ultra fine pitch, QFP, BGA, μBGA, CBGA
5.Advanced SMT assembly
6.Automated insertion of PTH (axial, radial, dip)
7.Cleanable, aqueous and lead-free processing
8.RF manufacturing expertise
9.Peripheral process capabilities
10.Pressfit back planes & mid planes
11.Device programming
12.Automated conformal coating