Manufacturer ASTM copper plate antique brass 5mm thick copper sheet 600mm width
GB/T | DIN | EN | ASTM |
TU2 | E Cu58 | Cu ETP | C11000 |
Material introduction:C11000(Cu ETP)
Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but
compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not
suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than
370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement when the material is heated to
600 ° C or higher the oxygen insidethe material will form water vapor with the hydrogen in the air causing
the internal structureof the material to be brittle and cremated so hydrogen embrittlement occurs.
Material Features:
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
Physical properties
Density(g/cm3) |
8.9 |
Electrical conductivity{IACS%(20℃)} |
100 |
Modulus of elasticity(KN/mm2) |
127 |
Thermal conductivity{W/(m*K)} |
394 |
Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃)
|
17.7 |
Mechanical Properties
Te mper |
Tensile Strength |
Elongation A50 |
Hardness |
(Rm,Mpa) |
% |
HV |
|
0 |
195min | 35min | 60max |
1/4H |
215-255 | 25min | 55-100 |
1/2H |
255-315 | 15min | 75-120 |
H |
290min | 5min | 80 |
Chemical composition
Cu | ≥99.90 |
O |
0.005-0.040 |
Manufacturer ASTM copper plate antique brass 5mm thick copper sheet 600mm width
rust-proof paper packaging inside and outside use plastic bags, wooden pallets