High Reliable Top Quality Silicone AB Glue for Electronics Encapsulant
Model No. EG-F008W
A heavily populated PCB generates excessive heat which need to be dissipated.
The housing for the PCB is designed in a aluminum to perform as a suitable heat sink. The PCB needs to be secured within the housing and protected from moisture, vibration and the thermal stress causes by large thermal cycles. Housed close to the engine, any material used must be capable of withstanding high operating temperature say +200℃.
PCB is fully encapsulated by silicone material providing a path for the heat and the protection from harsh environments, vibration and thermal shock.
Silicone encapsulant can be used to improve the light output and overall optical efficiency of the LED. Large outdoor mega screens are made up of many thousand LED's arranged in RGB formation. Once assembled these banks of LED's need to be potted for protection from the environment and improving definition and reducing reflection.
Key performances' comparison of LED encapsulant materials
Property | Silicone | Epoxy |
Temperature Range | -50~+250℃ Modern reflow soldering of diodes onto PCB's requires temperatures up to 250℃ which can cause the discoloration in epoxy and other resin based encapsulant, but not silicone. | -50~+150℃ |
Thermal Stability (Heat Resistance) | Long-term stable under prolonged periods of heat exposure | Deterioration in transmittance over time accompanied by yellowing of the encapsulant materials |
Flame Retardancy | Good | None |
UV Stability | Good | Poor |
Ozone Stability | Good | Fair |
Moisture Absorption | Good | Fair |
Young's Modulus (tensile module) | Low | High |
Thermal Expansion | High | Good |
Moisture Permeability | Fair | Good |
Hardness | Good | Excellent |
Adhesion Strength | Good | Excellent |
Mixing ratio of the chemicals: A:B=1:1, so total shipping net weight should be divided into double equal.
Silicone AB glue is packed into 1kgs/plastic jar, then 6jars/carton, or 25kgs/plastic bucket.
The shipping package is applicable to airfreight or seafreight from ZhuZhou, HuNan, China to the world.
1, MOQ is acceptable for Sample Test or Trial Order;
2, Immediately delivery available, and Mass production also available;
3, Actively 24/7 online service;
4, Dependable quality control systems and production processes
Hunan LEED Electronic Ink Co., Ltd.
1, What is "mix ratio"?
Mix ratio is a term used to state the amount of each material to be in a multi-component material. The mix ratio for 2-part products are described on the individual product data sheets and are given as a ratio by weight of each material.
2, How do I ensure that air is removed from 2-part grades?
If you are hand mixing, air may become added to the material during the mixing process. Vacuum de-airing is most effective in removing air prior to use. Automated mixing equipment that utilizes a static mixer can eliminate the need to de-air prior to dispensing. On complex high-density electronics, air can sometimes be trapped under components during the potting process. Where this is a concern, potting under vacuum or vacuum de-airing after potting can remove the trapped air. An alternate approach may be to use a grade with a low viscosity and longer pot life and to cure at lower temperatures (if heat-cure grade), allowing entrapped air to escap prior to the cure of the material.
3, What does "pot life" or "work life" mean?
The amount of time after a 2-part grade is mixed with its curing agent that it will remain useful or pliable.
4, How do I remove silicone?
Before it is cured: use a putty knife to remove any of the uncured paste. Wipe the area clean with isopropyl alcohol to remove any leftover residue.
After it is cured: First mechanically remove as much of the silicone as you can with either a knife or a razor. A solvent (mineral spirits, toluene, xylene, acetone) can be used to remove any oily residue or any remaining silicone. It may be necessary to soak the silicone in a solvent overnight to break it down.