The length of the preheating zone is 1200mm for this machine, if the preheating heating mode by IR or other bake , the flux on the PCB activation is not enough, so the machine adopts forced hot air, hot air heat transfer to the PCB through the high-speed circulation, to achieve the goal of fast heating.

Technical parameter

Technical specifications

System Control Method	Panel
Conveyor Width	Max.300mm
PCB Conveyor Direction	Left to right /Right to left
PCB size	50-300mm
PCB Soldering Angle	4-7°

PCB feeding height	750±50mm
Preheating area temperature	room temperature~200° adjustable

Preheating area length	1200mm
Preheating area quantity	3 sections

Nozzle flow shifting mode	Air pressure adjust
Solder pot capacity	250kg
Solder pot temperature	Max. room temperature~350°C

Wave motor	Variable frequency stepless speed regulation
Power supply	3 Ph 380V 50HZ
Total power	Approx. 19KW
Dimension	3100(L)* 1480(W)* 1780(H)mm (without guide rail)
Flux spraying mode	Cylinder
Weight	Approx.1300kg
Flux flow volume	10-100ml/min
Packing	Exemption wooden box and vacuum packaging

Packing size	L3300 * W1600 * H1900mm (no include track and lighthouse

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