NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm with a placement accuracy of up to 25 µm/3 sigma
SIPLACE MultiStar: Up to 25,500 cph
SIPLACE TwinStar: The head for special tasks
SIPLACE JEDEC Tray Feeder with up to 18 JEDEC trays
SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma
More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area
Placement force down to 0.5 N for sensitive components
Touchless placement: Maximum placement quality for highly sensitive components
NEW: SIPLACE Smart Pin Support: Automated pin mounting for printed circuit boards
NEW: Maximum PCB size 550 mm x 460 mm