Applicable Industries:: Electronic Component, Smartphone, Semi conductor, Mobile phone, Camera module, chip mounter, Camera equipment production expert, LCD grinding, cleaning and laminating machine, semiconductor precision equipment, Complete assembly and testing of 3C products, mobile phones and watches 3C product, Die Bonding Machine for CCM Camera Module

Showroom Location:: India

Video outgoing-inspection:: Provided

Machinery Test Report:: Provided

Marketing Type:: New Product 2020

Warranty of core components:: 1 Year

Core Components:: Engine, Motor, Die Bonding Machine for CCM Camera Module

Condition:: New

Place of Origin:: Guangdong, China

Brand Name:: D-WIN

Voltage:: AC220V

Power:: 3.5KW

Weight:: 1500

Dimension(L*W*H):: 2700x 1400 x 1970 mm

Warranty:: 1 YEAR

Product name:: Die Bonding Machine for CCM Camera Module

After Warranty Service:: Video technical support

Local Service Location:: India

Type:: 3 Spindle

Function:: Small-medium Production

Name:: Dwin- Wafer carrying -03A

Keyword:: Back Cover Fiber Laser Separating Machine

Item:: PCB Led Pick

Delivery:: 15 Days

Feature:: High Precision

Supply Ability

Supply Ability:: 50 Carton/Cartons per Month

Packaging & Delivery

Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

Product Pictures

Products Description

The product is taken out from the magazine by a precise delivery track ，Wafer auto stripping and feeding and positioned precisely;The multi-axis high-precision manipulator is visually guided by the industrial camera to complete the precision dispensing and wafer loading process of the product. Equipment application and industry: Semiconductor production technique and CCM camera module dispensing and laminating technique, to meet the position accuracy requirements of upper and lower assembly and lamination.

Features:

（1）High efficiency, overall UPH≥5000 pcs/H （2）High yield，yield≥ 99% (In addition to product incoming factors) （3）High precision, XY position accuracy :±10 μm deflection Angle ±0.2°bond head pressure 100~1000g (programmable)

Technical Parameters

Application	Fully automatic wafer loading
Model	Dwin- Wafer carrying -03A
Dimensions (LxWxH)	2700x 1400 x 1970 mm
Weight	2010KG
(LxW）	Loading and unloading machine carrier platform size： 320x 80mm
Auto Wafer size (LxW）	MAX：8inch
XY position accuracy	When the ambient temperature fluctuates within ±1°
XY Mounting accuracy	Depends on the stability of product accuracy
Bond head pressure control	50g~400g Accurate pressure to ±10g
10. UPH	5k~15k pcs/h According to the product process and the number of products on the vehicle
XY axis maximum speed	1500mm/s
Equipment cleanliness level	Grade 100
Power specifications	220 VAC (±5%) , 50-60 Hz
Total power	3KW

Company Profile

Shenzhen Shuangshi technology Co., LTD.

Founded in 2014, is a national high-tech enterprise focusing on R&D, production, and sales of intelligent manufacturing equipment. Headquartered in Longgang, Shenzhen, it has four wholly-owned subsidiaries, 2 R&D centers, and two manufacturing bases. Focus on precision dispensing, assembly equipment research and development, good at semiconductor, LCD and camera industry precision glue injection, assembly, laser cutting and welding, smart CCD positioning detection, and other aspects of application technology, focus on global production and manufacturing to provide efficient and complete solutions. Why Choose Us The products of the company are characterized by refinement, automation, and informatization, and are supported by independent intellectual property rights, and are identified as "national high-tech products."D-win service customer groups cover many well-known enterprises at home and abroad, including Xinli, Helitai, Oufei, Guangbao, LG, Lijing, Shunyu, Ruisheng science, and technology, etc. After six years of steady development, D-win has become a well-known domestic intelligent manufacturing equipment production enterprises. We hope that in the future, we will become a world-class one-stop service provider of intelligent equipment and non-standard equipment and create a D-win platform for shared prosperity and prosperity.

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1000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

2000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

3000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

4000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

5000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

6000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

7000#Hot Selling Die Bonding Machine for CCM Camera Module with Reliable Performance precision dispensing & wafer loading Die bonder

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