1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg Fr4), Rogers High frequency material, Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
4 | PCB Max size | 1200mm × 560mm |
5 | Layer | Mass production: 1~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
7 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
8 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
9 | PCBA QC | ICT,SPI,AOI online,X-ray, AOI offline, Functional Test |
10 | SMT Capacity | 800Million Points/Day |
11 | DIP Capacity | 0.6Million Points/Day |
12 | Our services | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, conformal coating spraying, Plastics&Molds, finished product assembly, aging test, PCB manufacturing from 1 to 64 layers,PCB circuit design,Free DFM check,Embedded Development,NPI trial production report.Lithium battery protection board solve scheme, Bluetooth, wifi and other module scheme. |