SMT, BGA, CSP, Flip Chip, LED Detection,
Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic,
Aluminium Die-casting, Moulding Plastic.
Ceramics, other special industries.
Item | Description | Specifications | |
X-Ray Tube | Max. Voltages, Type | 130kV (Option 110KV), Closed | |
Power Consumption | 40W(25W) | ||
Focal Spot Size | 3 μm | ||
Magnification | 1600X | ||
Detector | Detector Type | FPD | |
Resolution | 101 LP/cm | ||
Effective Area | 116.4mm ×145.7mm | ||
System Computer | Operating System | Industrial PC, Win 7, i7 Processor | |
Monitor | 22” LCD | ||
Software | User Interface | Unicomp Multi-function DXI image processing system | |
Working Platform | Max. Loading Area | φ570mm | |
Max. Inspection Area | 450mm×450mm | ||
Max. Loading Weight | 10kg | ||
Movement Control | Joysticks, Mouse and Keypads | ||
Motion Range (Up and Down) | 200mm | ||
Table Tilting Angle | 55° Tilting and 360° Rotation | ||
Navigation | Camera | HD Camera, Laser point | |
Axis | Manipulator | 6-axis with X1/ X2 / Y / Z / T(55°) / R(360°) | |
Equipment Features | Power Supply | AC 110~220V (±10%) 50Hz, 2.0kW | |
Outline Dimensions | 1450(W)×1500(D)×1850(H)mm | ||
System Weight | 1900 kg | ||
Optional Accessories | None | ||
Warranty | One year warranty , free replacement the parts due to original manufacturer's defect, but expect of man-made damages and force majeure |