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High Transparency 3D Floor Making Use Coating Epoxy Resin AB Glue
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Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--Product Description
Product Description
Epoxy resin 113AB-1 is an epoxy resin glue that cures under normal temperature and heating conditions. It has good leveling, natural defoaming, yellowing resistance, high transparency and no ripples, bright surface, suitable for normal heating curing.
Epoxy resin 113AB-1 is specially used for insulation, moisture-proof potting, confidentiality sealing of photo frames, 3D floors, desktop glue, crafts, glue, badges, high-end resin characters and other electronic parts.
Technical parameter
Resin 312A-113-1 | Hardener 312B-113-1 | ||
Color | Colorless&Clear | Colorless&Clear | |
Density (g/m3) | 1.07+0.05 | 0.95+0.03 | |
Viscosity (mPa·s) | 3000+1,000 | 80max | |
Brookfield DV2TRV Test method | 25℃ | ||
Mixing ratio (by weight) | 3 ： 1 | ||
(By volume) | 2.7 ： 1 | ||
After mixing
Resin+Hardener | ||
Status | Fluid | |
Viscosity | 150±50mPa.S | |
Brookfield DV2TRV Test method | 25℃ | |
Operating time (100g, 25℃) | 40±5 min | |
Brookfield DV2TRV Test method, viscosity up to 800mPa•s | ||
Dosage | 280-350 g/m2(Depending on the base material) | |
Curing time
Initial curing | About 10-12 hrs at room temperature |
Final curing | 2-3 days at room temperature |
Operating temperature range | 10℃-70℃ |
Instructions
Please keep the container clean. The parts A and B are proportioned strictly according to the weight ratio, accurately weighed, and fully stirred clockwise along the inner wall of the container, and then allowed to stand for 3-5 minutes before use.
Adjust the amount of glue according to the operating time and amount to avoid waste. When the temperature is lower than 15℃, please preheat the A glue to 30 ℃ before adjusting the glue, easy to operate (A glue will thicken when the temperature is low); The lid must be sealed after use to avoid product scrap due to moisture absorption. When the relative humidity is greater than 85%, the surface of the cured product will easily absorb the moisture in the air and form a layer of white mist. Therefore, when the relative humidity is greater than 85%, it is not suitable for room temperature curing. It is recommended to use heated curing.
Test Results
Hardness | shoreD | 84 |
Bending strength | Kg/mm2 | 28 |
Heat distortion | ℃ | 50 |
Water absorption | % | <0.1 |
Compressive strength | Kg/mm2 | 8.4 |
Storage
Whether freezing | Yes | ||
Moisture sensitive | Resin | Hardener | |
No | Sensitive | ||
Recommended storage temperature | 15℃-25℃(Not lower than 10℃, not higher than 50℃) | ||
Valid period | 6 months from the original packaging | ||
Package | Resin | Hardener | |
5 kg/pot | 5 kg/pot | ||
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