High Temperature Thermal Electrical Insulation Board
Forming Machine High Temperature Thermal Electrical Insulation Board
| Name of product | Glass fiber mat | model | GPO-3 |
| Substrate | Non-alkali chopped strand mat+Unsaturated resin | proportion 1.5 | |
| project | Test Methods | unit | Test Results |
| Flammability rating | A | -- | 94-V0 |
| Bending strength(Landscape) | A | kg/mm² | 38-45 |
| Heat resistance(120min) | A | ℃ | 200(OK) |
| Impact strength | A | kg-cm/cm² | ----- |
| Bond strength | A | kg | ----- |
| Water absorption | E-24/50+D-24/23 | % | 0.05-0.07 |
| Acetone resistance | bolied | Min | 30(OK) |
| Pressability | A | ℃ | 20 |
Application:
1.It was commonly used in ICT, ITE fixture needle plate, carrier board and various functions of governance needle plate carrier board and a variety of
anti-static requirements fixture or equipment.
Surface of the plate is well-protected and accurate index processing performanceis good. And supporting the thin-shaped substrate or a flexible printed circuit board
2, the irregular shape of the substrate
3 can be used for multi-link plate, can carry bending phenomenon of wave soldering in order to increase productivity, preventing the substrate in the reflow generated
has the temperature was gradually increasedenvironment, can still maintain .
Standard thickness:more than 2mm
We can customize according to customers' specification demand
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