PCB Assembly Capability | ||
Item | Capability | |
Advantages | ----Professional Surface-mounting and Through-hole soldering technology | |
----Various sizes like 1206,0805,0603 components SMT technology | ||
----ICT(In Circuit Test),FCT(Functional Circuit Test) | ||
----PCB Assembly With UL,CE,FCC,Rohs Approval | ||
----Nitrogen gas reflow soldering technology for SMT. | ||
----High Standard SMT&Solder Assembly Line | ||
----High density interconnected board placement technology capacity. | ||
Components | Passive Down to 0201 size | |
BGA and VFBGA | ||
Leadless Chip Carriers/CSP | ||
Double-sided SMT Assembly | ||
Fine Pitch to 0.8mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement | ||
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized | |
Type of Assembly | SMT, Thru-hole | |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |
Bare Board Size | Smallest:0.25*0.25 inches | |
Largest:20*20 inches | ||
File Formate | Gerber files, Pick-N-Place file, Bill of Materials | |
Types of Service | Turn-key,partial turn-key or consignment | |
Component packaging | Cut Tape,Tube,Reels,Loose Parts | |
Turn Time | Same day service to 15 days service | |
Testing | Flying Probe Test,X-ray Inspection AOI Test | |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |