PCBA process
• Equiped with SPI machine and AOI inspection machine
• 01005 components, fine pitch and high count BGAs, Package on Package
(POP)
• Chip on Board, fiber optics, RF microelectronics, press fit connectors
• Hybrid processes (tin-lead and lead-free), pin through hole, wave &
selective soldering, double and single sided reflow, wide body and
backplanes
• Quick turn prototype assembly, RoHS compliance certification, conformal &
parylene coating, laser marking
• Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray
equipment
• Comprehensive electrical testing and test system development for
boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)