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Gsm Phone Board Circuit Pcba Smartphone Mobile Android Pcb
  • Gsm Phone Board Circuit Pcba Smartphone Mobile Android Pcb

Gsm Phone Board Circuit Pcba Smartphone Mobile Android Pcb

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
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Product Description
Overview
Quick Details
Model Number:
oem
Place of Origin:
Jiangxi, China
Brand Name:
pcb board
Base Material:
FR-4 CEM-3 CEM-1 HD FR-1 94V0 TG170
Copper Thickness:
0.5oz-4oz
Board Thickness:
0.4T-4.0T
Min. Hole Size:
0.2mil
Min. Line Width:
3mil
Min. Line Spacing:
3mil
Surface Finishing:
OSP / HASL /ENG
Board Size:
5---1200mm
Product name:
Circuit Board
Solder mask color:
White.Black.Yellow.Green.Red.Blue
Layer:
1-12 Layers
Supply Ability
Supply Ability:
80000 Square Meter/Square Meters per Month
Packaging & Delivery
Product Description

New arrival high performance universal tv lcd controller board

Product details

Product name Circuit Board
Solder mask color White.Black.Yellow.Green.Red.Blue
Layer 1-12 Layers
Product Keywords lcd controller board bt14ogw01,universal lcd controller board tv,15 inch lcd controller board
 




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technological
ITEMS      Parameter Remarks
     Double side & Multi-layer 
Number of Layers       1-20 layers   
Board Materials       FR4,CME3,CME1,5G  
PCB Size (Min- Max)       50x80mm  to 1000mm×600mm ( 39.37"x23.6")  
innerlayer line width/space(min)      4mil/4mil(100um/100um)  
Finish Plating /Surface Finishes       HASL ,OSP,ENIG,HASL,gold finger,Au Panel,OSP,ENIG,  
 innerlayer pad (min)      5mil(0.13mm) Pad annular
Core thickness (min)       8mli(0.2mm)  
Finisher Copper Inner Layers       1/2oz(17um)a- No Cu Clad
Finished Copper Outer Layers       1/2oz(17um)  
Final PCB Thickness (tolerance %)
 
     0.5-4.0mm  
Final PCB Thickness (tolerance %)
 
Thickness<1.0mm      ±12% 4-8layers
1.0mm≤Thickness&lt;2.0mm      ±8% 4-8layers
     ±10% ≥10layers
Thickness≥2.0mm     ±10%  
inner layer process      Brown Oxide  
Minimum Conductor Space      ±3mil(±76um)  
Minimum Drill Hole Size      0.25mm  
min diameter of finished hole     0.2mm  
Hole position accuracy      ±2mil(±50um)  
 Drilled slot tolerance       ±3mil(±75um)  
PTH tolerance       ±2mil(±50um)  
 NPTH tolerance      ±1mil(±25um)  
maxA.R.Of PTH     8:1  
PTH hole copper thickness     0.4-2mil(10-50um)  
image to image tolerance     ±3mil(0.075mm)  
outer layer line width/space(min)    3mil/3mil(75um/75um)  
Solder Mask Thickness    line end 0.4-1.2mil(10-30um)  
   line Corner ≥0.2mil(5um)  
   on Substrate ≤Finished Cu thickness+1.2mm≤Finished Cu thickness+30um)≤+1.2mil≤+30um)  
min solder mask dam     4.0mil(100um)  
impedance control and tolerance      50Ω±10%  
warp and twist     ≤0.5%  
Delivery time      1-2 layers 10-12days  
    4-20 layers 12-20days  
Package     General export packaging   


 

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