Key Parameters Of HDI Board | ||||||
Item | Standard | Advanced | ||||
Structure | 6+N+6 | 7+N+7 | ||||
HDI Stack Via | Any Layer(14L) | Any Layer(16L) | ||||
Min Trace/Spacing | Inner | 50/50um | 40/40um | |||
Outer | 50/50um | 40/50um | ||||
PCB Aspect Ratio | Max PCB Aspect Ratio | 0.8:1 | 1:1 | |||
Drilling Size | Min Laser Drilling | 4mil | 3mil | |||
Min. Core Thickness | 40um | 40um | ||||
Min BGA Pitch | 0.4mm | 0.3mm |
HDI PCB LEAD TIME | ||||
Layer | Quick Turn/Normal Time | Mass Production | ||
4L | 4 days /8 days | 12-15 days | ||
6L | 7 days /11 days | 15-18 days | ||
8L | 9 days /14 days | 18-22 days | ||
10L | 11 days /16 days | 22-25 days | ||
≥12L | 13 days /18 days | 25-30 days |