Lwlp5xxd series integrated low-voltage high-precision pressure sensor encapsulates high-performance MEMS pressure sensitive chip and special conditioning chipIn the structure of dual nozzle sop14, the pressures in the two gas circuit structures refer to each other to reduce the impact of the environment on the output. Lwlp5xxd mining The unique algorithm realizes multi-stage temperature compensation for the sensor and outputs it in the form of digital IIC. Provide products with gauge pressure or differential pressure air inlet.
application:Industrial control,fitness equipment,medical monitoring,automotive applications,household appliances
High accuracy
Calibrated compensation
Performance Parameter | |||||
parameter | minimum | typical | maximum | Company | remarks |
Supply voltage | 1.8 | 3.3 | 3.6 | V |
|
Working current |
| 1 |
| mA |
|
Range | -1~1,-2.5~2.5,-5.5~5.5,-10 ~10,-20~20, -40 ~40etc | kPa |
| ||
Sleep current |
| 20 |
| nA |
|
ADC |
| 24 |
| bit |
|
Accuracy |
|
| ±1 | %FS |
|
Response time |
| 5 | 30 | ms |
|
Compensation temperature | -20 |
| 80 | ℃ |
|
Working temperature | -40 |
| 85 | ℃ |
|
Storage temperature | -40 | 0.05 | 120 | ℃ |
|
Temperature output range | -40 |
| 85 | ℃ |
|
Temperature accuracy |
| 1 |
| ℃ |
|
Unless otherwise specified, all values in this table are tested under the conditions of voltage 3.3Vdc and temperature 25℃ |
Note:
(1) Divided into two forms of gauge pressure and differential pressure;
(2) Accuracy refers to the output accuracy of the product in a clean gas environment within the compensation temperature range; the accuracy is determined by the linearity, repeatability and hysteresis of the product;
(3) The temperature display range of conventional products is -40~85℃, and can output -40~110℃ under special requirements;
(4) The sensor is in a constant temperature field, and the detection accuracy of the ambient temperature;
Longwei technology Wuxi Co., Ltd. was established in 2014
Registered capital: RMB 31625000
Dragon micro technology is a high-tech company focusing on the integration of MEMS pressure sensor, MEMS acceleration and other wafer development, sensor packaging and calibration.
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