PCB Manufacturing; PCB Layout; PCB Prototyping; SMT Assembly; Through-Hole Assembly; PCB Design, Copy Services; Domestic and Original Components Sourcing; Fixture Test, AOI Test, Functional Test, X-Ray Scan Test for BGA; Enclosure Assembly.
CAPABILITY |
STANDARD |
ADVANCED |
MinimumLayer Count |
1 |
1 |
Maximum Layer Count |
12 |
40 |
Material |
FR-4 (Tg-135C, 145C, 170C), Halogen-free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core |
|
Board Thickness |
0.020"-0.125" |
0.005"-0.250" |
Maximum Board Size |
16" x 22" 12" x 21" 22" x 28" |
10" x 16" 16" x 22" 12" x 21" 22" x 28" |
Copper Thickness |
0.5 oz – 3 oz |
0.25 oz – 12 oz |
Minimum Trace Width / Spacing |
0.004"/0.004" |
0.003"/0.003" |
Solder Mask Color |
Green, Blue, Black, Red, Yellow, White, Clear, and customized |
|
Silkscreen Color |
White, Black, Yellow, Green, Red, Blue and customized |
|
Minimum Hole Size |
0.008" |
0.004" |
Finished Hole Size Tolerance |
+/-0.003" |
+/-0.002" |
PCB Surface Finish |
HASL (vertical & Horizontal), Lead-Free HASL, OSP/Entek, ENIG, ENEPIG, HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold |
|
IPC Class |
Class 2 |
Class 3 |
Controlled Impedance Tolerance |
+/-10 % |
+/-5 % |
Blind Vias |
Yes |
Yes |
Buried Vias |
Yes |
Yes |
Aspect Ratio |
8/1 |
15/1 |
Minimum Core Thickness |
0.004" |
0.002" |
Carbon Ink |
Yes |
Yes |
Peelable Mask |
Yes |
Yes |
Solder Sample |
Yes |
Yes |
First Article |
Yes |
Yes |
ISO 9001: 2008 |
Yes |
Yes |
ISO/TS16949: 2009 |
Yes |
Yes |
94v0 |
Yes |
Yes |