Seq | Item | capability |
1 | Base Material | FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,PI ,etc |
2 | Layers | 1-40 ( ≥30 layers needs review ) |
3 | Finished inner/outer copper thickness | 0.5-6OZ |
4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
Board thickness≤1.0mm: +/-0.1mm 1Board thickness>2.0mm: +/-8% | ||
5 | Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
6 | Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
7 | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil | ||
8 | Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
10 | Aspect Ratio | 15:01 |
11 | Min welding ring | 4mil |
12 | Min solder bridge | ≥0.08mm |
13 | Plugging vias capability | 0.2-0.8mm |
14 | Hole tolerance | PTH: +/-3mil NPTH: +/-2mil |
15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
16 | Solder color | Green,yellow,black,blue,red,white,matte green |
17 | Component mark color | white,yellow,black |
18 | Surface treatment | OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue Carbon ink Gold plating: Au 1-150U’’ |
19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
Min spacing from test pad to board edge : 0.5 mm | ||
Min conductive resistance : 5 Ω | ||
Max insulation resistance : 250 MΩ | ||
Max test voltage : 500 V | ||
Min test pad diameter : 6 mil | ||
Min test pad to pad spacing : 10 mil | ||
Max test current : 200 MA | ||
20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch |