1-20 layer of hign-precision impedance boards,blind&
buried boards,HDI board.
Base materials:FR4,FR4 High TG(TG150,TG170).
This form demonstrates specification and requirement of multilayer PCB
ITEM | TECHNICAL DATA | ITEM | TECHNICAL DATA |
Layers | 2-30(layers) | Min Board Thickness | 4layers:0.40mm/16mil |
Max Board Size | 250x650mm | 6layers:0.80mm/32mil | |
Min Line Width | 0.10mm/4mil | 8layers:1.00mm/40mil | |
Min Line Space | 0.10mm/4mil | 10layers:1.20mm/48mil | |
Min Hole Size | 0.20mm/8mil | Insulation Resistance | 1E+12Ω(Normal) |
PTH Wall Thickness | 0.020mm/0.8mil | Aspect Ratio | 10:1 |
PTH Dia Tolerance | ±0.05mm/±2mil | Thermal Shock | 288℃/3x10Sec@288℃ |
NPTH Hole Dia Tolerance | ±0.025mm/±1mil | Warp and Twist | ≤0.7% |
Hole Position Deviation | ±0.05mm/±2mil | Electric Strength | >1.3KV/mm |
Outline Tolerance | ±0.1mm/±4mil | Peel Strength | 1.4N/mm |
S/M Pitch | 0.08mm/3mil | Solder Mask Abrasion | >6H |
Flammability | 94V-0 | Impedance Control | ±5% |
Our products are widely applied in electronic devices and household appliances, such as telecom, autoparts, automoblie electronics, computers, medical equipments and consumer electronics.
Since established by a group of young engineer and sales in 2008, Sunsoar keeps developing and expanding, it is being committed as R&D professional high-precision and special material PCB and capable to make 4-28 layers high-precision impedance, multi-layer blind-layer hole, high Tg,Albase, Copper base and ceramic PCB,1-6 layers FPC , Etc.
The company takes ISO9000 Standardization managemeng and have certified UL,RoHS international certification. 1-20 layer of hign-precision impedance boards,blind&
buried boards,HDI board.
Base materials:FR4,FR4 High TG(TG150,TG170).
Electronic Components sourcing.PCB Assemblies,PCBA Assemblies,PCBA function test OEM&ODM are welcomed,No MOQ requirements